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| MS765 PRESSURE SENSOR DIE (0-0.5 BAR) * * * * 0 to 50 kPa range (0.5 bar or 7.25 PSI) Absolute/differential pressure sensors Medical/industrial applications RoHS-compatible & Pb-free1 DESCRIPTION The sensor element of the MS765 consists of a silicon micro-machined membrane. Implanted resistors make use of the piezo-resistive effect to sense the membrane deflection and transform it in an electrical signal. This sensor, which has outstanding span values, is available in various configurations. The absolute pressure sensor employs a sealed vacuum reference cavity underneath the membrane. The Pyrex glass wafer used for this sealing has a thickness of 0.2 mm (MS765-A_0.2) or 0.5 mm (MS765-A_0.5). There are two gauge versions available: one with a drilled Pyrex glass (MS765-D) and the other without Pyrex glass (MS765-S). FEATURES * * * Uncompensated pressure sensor die Output Span 170 mV @ 500 mbar & 5V Temperature Range -40 ...+125 C * * * Linearity 0.05% (typical) Small Die Size 1.96 x 2.10 mm (MS765-A) Low Cost, High reliability APPLICATION * * * Absolute/Differential pressure sensor systems Variometers Liquid level control * * Blood pressure meters Industrial applications ELECTRICAL CONNECTIONS Positive output for pressure applied topside Vs+ EPI Vs+ : Supply voltage of Wheatstone bridge Epi : Connection of epitaxial layer (membrane) Out+ OutOut- : Negative output Out+ : Positive output GND1 : Ground GND2 : Ground GND1 1 GND2 The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). DA765_000.doc 000007651507 ECN 1186 March 19, 2009 1/6 BOND PAD CONFIGURATION Important remarks: Out+ MS765 Vs+ As the sensing elements are diffused resistances, the voltage applied on the ground pads (GND1 and GND2) has to be lower than the voltage applied on supply voltage pad (Vs+). The epitaxial layer is connected to the Vs+ pin on the die. Gold ball bonding or aluminium wedge bonding can be used to wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this reason, it is strongly recommended that a thorough wire-bonding qualification is made by the end user if the sensor is going to be operated over an extended temperature range. GND1 Epi GND2 Out- LAYOUT (Absolute sensors) MS765-A_0.2 MS765-A_0.5 Pad opening in passivation is 100 m DA765_000.doc 000007651507 ECN 1186 March 19, 2009 2/6 LAYOUT (Gauge sensors) MS765-D MS765-S Pad opening in passivation is 100 m FULL SCALE PRESSURE kPa 50 bar 0.5 mbar 500 PSI 7.5 atm 0.5 mm Hg 375 m H2O 5.1 Inches H2O 200 ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Pressure overload Symbol VS+ TS Ta = 25 C -40 o Conditions Min Max 20 +150 3 Unit V C Bar o DA765_000.doc 000007651507 ECN 1186 March 19, 2009 3/6 ELECTRICAL CHARACTERISTICS (Reference conditions: Supply Voltage VS+ = 5 Vdc; Ambient Temperature Ta = 25 ) C Parameter Operating Pressure Range Operating Temperature Range Bridge Resistance Span (FS) @ 500 mbar Span (FS) @ 250 mbar Span (FS) @ 50 mbar Zero Pressure Offset Linearity Temperature Coefficient of Resistance Span Offset Pressure Hysteresis Repeatability Temperature Hysteresis NOTES Min 0 -40 3.0 150 75 13 -40 Typ Max 0.5 125 Unit Bar C k mV mV mV mV % FS ppm/ C ppm/ C V/ C % FS % FS % FS 1 2 Notes 3.4 170 85 17 0 0.05 3.8 190 95 20 40 0.2 + 3300 - 2300 + 80 0.15 0.15 0.3 + 2400 - 1500 - 80 + 2800 - 1900 0.05 0.05 3 4 5 1) Deviation at one half full-scale pressure from the least squares best line fit over pressure range (0 to 0.5 bar). 2) Slope of the endpoint straight line from 25 to 60 C C. 3) Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 C. 4) Same as 3) after 10 pressure cycles 5) Maximum difference in offset after one thermal cycle from -40 to +125 C C. DA765_000.doc 000007651507 ECN 1186 March 19, 2009 4/6 PICKING TOOLS The MS765 sensors have a sensitive membrane size of 0.95 x 0.95 mm and outer dimensions of 2.1 x 1.96 mm (MS765-A_0.2, MS765-A_0.5 and MS765-D) and 2.13 x 1.99 mm (MS765-S). The pick and place tool has to be of a soft material such as rubber (Hardness 78-97 Shore A). Its external size must fit the sensor and the vacuum cavity must be as large as the membrane itself. Successful tests have been made with specific SPT tools, see SPT drawing and references below. Ensure that the ejection pins do not touch the membrane for gauge versions. SPT references External dimension Internal dimensions RTR-A1-060x060 TL & TW: 0.06 inch /1.52 mm H: 0.035 inch / 0.89 mm CTR-A1-080 F: 0.08 inch / 2.03 mm H: 0.035 inch / 0.89 mm ORDERING INFORMATION Product Code MS765-A_0.2 MS765-A_0.5 MS765-D MS765-S Type Absolute Absolute Differential Differential Product 0.5 bar Pressure Sensors 0.2 mm Pyrex sawn on b/f 0.5 bar Pressure Sensors 0.5 mm Pyrex sawn on b/f 0.5 bar Pressure Sensors sawn on b/f 0.5 bar Pressure Sensors no Pyrex sawn on b/f Art.-Nr. 76525022 76525021 76525121 76525221 The MS765 dice are supplied sawn on blue foil, mounted on plastic rings DA765_000.doc 000007651507 ECN 1186 March 19, 2009 5/6 FACTORY CONTACTS Factory and European Sales office Intersema Sensoric SA Ch. Chapons-des-Pres 11 CH-2022 Bevaix Switzerland Phone: +41 32 847 9550 Fax: +41 32 847 9569 e-mail: Website: www.intersema.ch USA Measurement Specialties Inc. 1000 Lucas Way Hampton, VA 23666 USA Phone: Fax: e-mail: Website: +1 800 555 1551 +1 757 766 4297 sales@meas-spec.com www.meas-spec.com ASIA Measurement Specialties (China), Ltd. F1.6-4D, Tian An Development Compound Shenzhen, China 518048 Phone: Fax: e-mail: Website: +86 755 8330 1004 +86 755 8330 6797 pfc.cs.asia@meas-spec.com www.meas-spec.com NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. DA765_000.doc 000007651507 ECN 1186 March 19, 2009 6/6 |
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